CANON MACHINERY INC
    Corporate Info
  1. Management Philosophy
  2. Corporate Profile
  3. Bases
HOME > Update List
Update List
DATE
LIST
2013/04/18
Canon Mahinery .Inc introduces a new die bonder
[BESTEM-D11]
2012/10/15
The safety of using Canon IR Image Furnace are as follows
2012/07/17
Canon Mahinery .Inc introduces a new die bonder
[BESTEM-D15]
2012/03/21
Notice Change of Representative Directors and Officers
2011/08/01
Our Service and Sale in the China Market
2010/09/06
Request for safe handling of our devices
2010/07/15
Maintenance Policy Guide for CPS Series (SC10-A01)
2009/12/07
Relocation Notice of Representative Office
2009/10/01
Relocation Notice of Representative Office
2009/02/04
Discontinued Parts
2007/10/05
Relocation Notice of Subsidiary Company
2006/06/26
INVESTORS' GUIDE 2006
2005/12/17
Company Name Change
2005/12/17
BESTEM-D03
2005/12/17
SEMICON JAPAN 2005
2005/10/31
Singulation Machine [SDM-400SH], [SDM-210S]
2005/10/26
Notice of Company Name Change
2005/08/05
SEMICON Taiwan 2005
2005/07/26
INVESTORS' GUIDE 2005
2005/04/22
SEMICON Singapore 2005
2004/07/13
INVESTORS' GUIDE 2004
2003/10/17
Business Principles for the Second Hlf of 2003
2003/07/18
The selling start of a new product "BESTEM-D01"
2003/07/10
INVESTORS GUIDE 2003
2003/05/01
Soft Opening of Representative Office in Malaysia
2003/04/07
2003 the 1st Half Term Business Strategy
2003/03/13
Re-organization of Overseas Sales Structure
2002/11/11
Update : Management Philosophy, Management Principles
2002/08/13
Exhibition Information
2002/03/14
Product information was updated
2002/01/21
3rd IC Packaging Technology EXPO
2001/11/06
SEMICON Japan 2001
2001/08/27
The Implementation of the Business Structural Reforms
2001/07/19
INVESTORS GUIDE 2001
2001/06/22
New Products
2001/06/04
Guidance of a Exhibition (SEMICON Taiwan 2001, SEMICON Singapore 2001)
2001/04/27
Nortification of Cange in Number of Stocks per Unit Notification Concerning Acquisition of Own Stock for Purpose of Implementing Stock Option System
2001/04/09
The 2001 fiscal year President object
2001/02/23
Dividend at the end of March 2001
2001/01/31
Completion of Our Fifth Plant
2001/01/31
Establishment of a Subsidiary
2000/12/22
INVESTORS' GUIDE 2000
2000/10/06
Listed on the 2nd Sector Market of the Osaka Securities Exchange
2000/07/01
CORPORATE NAME CHANGE TO "NEC MACHINERY CORPORATION"
2000/04/11
INTRODUCTION OF SEMICON・SINGAPORE 2000
2000/02/24
NEW RODUCTS
High-speed Epoxy Die Bonder (CPS-1800/1800S)
FC CSP High Accuracy Die Bonder (CPM-8100)
Flexible Laser Graph (FLAG-300)
High-speed Soft Solder Die Bonder (CPS-4000)
Chip LED Die Bonder (CPS-610)
High-speed Epoxy Die Bonder (CPS-110)
2000/02/18
RENEWAL TOP PAGE
RENEWAL Single Cristal Growing Apparatus
ISO14001
1999/10/29
INTRODUCTION OF SEMICON・JAPAN99 and INTERNEPCON・JAPAN2000
1999/06/29
INTRODUCTION OF SEMICON・SINGAPORE99
NEW PRODUCTS (CPS-600,TERMINAL INSERTER)
1999/04/21
YEAR 2000 COMPLIANCE
1999/01/11
INTRODUCTION OF INTERNEPCON・JAPAN 99
1998/11/13
INTRODUCTION OF SEMICON・JAPAN98
1998/11/09〜
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