HOME > Update List
- DATE
- LIST
- 2011/08/01
- Our Service and Sale in the China Market
- 2010/09/06
- Request for safe handling of our devices
- 2010/07/15
- Maintenance Policy Guide for CPS Series (SC10-A01)
- 2009/12/07
- Relocation Notice of Representative Office
- 2009/10/01
- Relocation Notice of Representative Office
- 2009/02/04
- Discontinued Parts
- 2007/10/05
- Relocation Notice of Subsidiary Company
- 2006/06/26
- INVESTORS' GUIDE 2006
- 2005/12/17
- Company Name Change
- 2005/12/17
- BESTEM-D03
- 2005/12/17
- SEMICON JAPAN 2005
- 2005/10/31
- Singulation Machine [SDM-400SH], [SDM-210S]
- 2005/10/26
- Notice of Company Name Change
- 2005/08/05
- SEMICON Taiwan 2005
- 2005/07/26
- INVESTORS' GUIDE 2005
- 2005/04/22
- SEMICON Singapore 2005
- 2004/07/13
- INVESTORS' GUIDE 2004
- 2003/10/17
- Business Principles for the Second Hlf of 2003
- 2003/07/18
- The selling start of a new product "BESTEM-D01"
- 2003/07/10
- INVESTORS GUIDE 2003
- 2003/05/01
- Soft Opening of Representative Office in Malaysia
- 2003/04/07
- 2003 the 1st Half Term Business Strategy
- 2003/03/13
- Re-organization of Overseas Sales Structure
- 2002/11/11
- Update : Management Philosophy, Management Principles
- 2002/08/13
- Exhibition Information
- 2002/03/14
- Product information was updated
- 2002/01/21
- 3rd IC Packaging Technology EXPO
- 2001/11/06
- SEMICON Japan 2001
- 2001/08/27
- The Implementation of the Business Structural Reforms
- 2001/07/19
- INVESTORS GUIDE 2001
- 2001/06/22
- New Products
- 2001/06/04
- Guidance of a Exhibition (SEMICON Taiwan 2001, SEMICON Singapore 2001)
- 2001/04/27
- Nortification of Cange in Number of Stocks per Unit Notification Concerning Acquisition of Own Stock for Purpose of Implementing Stock Option System
- 2001/04/09
- The 2001 fiscal year President object
- 2001/02/23
- Dividend at the end of March 2001
- 2001/01/31
- Completion of Our Fifth Plant
- 2001/01/31
- Establishment of a Subsidiary
- 2000/12/22
- INVESTORS' GUIDE 2000
- 2000/10/06
- Listed on the 2nd Sector Market of the Osaka Securities Exchange
- 2000/07/01
- CORPORATE NAME CHANGE TO "NEC MACHINERY CORPORATION"
- 2000/04/11
- INTRODUCTION OF SEMICON・SINGAPORE 2000
- 2000/02/24
- NEW RODUCTS
High-speed Epoxy Die Bonder (CPS-1800/1800S)
FC CSP High Accuracy Die Bonder (CPM-8100)
Flexible Laser Graph (FLAG-300)
High-speed Soft Solder Die Bonder (CPS-4000)
Chip LED Die Bonder (CPS-610)
High-speed Epoxy Die Bonder (CPS-110) - 2000/02/18
- RENEWAL TOP PAGE
RENEWAL Single Cristal Growing Apparatus
ISO14001 - 1999/10/29
- INTRODUCTION OF SEMICON・JAPAN99 and INTERNEPCON・JAPAN2000
- 1999/06/29
- INTRODUCTION OF SEMICON・SINGAPORE99
NEW PRODUCTS (CPS-600，TERMINAL INSERTER） - 1999/04/21
- YEAR 2000 COMPLIANCE
- 1999/01/11
- INTRODUCTION OF INTERNEPCON・JAPAN 99
- 1998/11/13
- INTRODUCTION OF SEMICON・JAPAN98
- 1998/11/09〜
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