This equipment fixes the work supplied from the magazine on a direct adsorption plate, and it carries out high precision cutting at a predetermined size.
The work after cutting performs package extraction with an adsorption pad, performs a drainer after pre washing, and contains it to a JEDEC tray.

Semiconductor Package

Resin board

Glass

Ceramics

Appricable products	Size : max. 300 mm Thickness : 0.5 - 2mm
Machine dimensions	3,200 (W) × 1,900 (D) × 1,750 (H) mm