CANON MACHINERY INC
    Products
  1. Die Bonder
  2. Die Sorter
  3. Handler
  4. Inspection equipment
  5. Other semiconductor fabrication equipment
  6. Substrate processing equipment
  7. Electronic components related equipment
  8. Display & Liquid crystal related equipment
  9. IC card & IC tag related equipment
  10. Battery related equipment
  11. Superconductivity related equipment
  12. Automobile Electronic components related equipment
  13. Medical part assembly equipment
  14. Exhibition
HOME > Products > Die Sorter
Die Sorter
Model Name Equipment Name Outline
CAP-300II Digital Die Sorter High speed and stable continous work is realized andreliability is progressed by employing a sort and low vibratory digital head.
CAP-400II Digital Package Sorter The equipment is an automatic picker. It picks up packages on a flat ring. After flipping them, it lines up and deposits them on JEDEC tray.
CAP-500 Digital Die Sorter This equipment picks up compact leadless packages (chip-size packages) attached to the wafer ring one at a time, and then performs taping after an appearance inspection such as solder ball inspection takes place on the side-inversing table.
CAP-3000II Digital Die Sorter
CAP-3500 Digital Die Sorter
Needleless Pickup Unit Needleless Pickup Unit The unit can be mounted on die bonder and die sorter machines from Canon Machinery Inc, and can be supplied independenthly.