This equipment picks up compact leadless packages (chip-size packages) attached to the wafer ring one at a time, and then performs taping after an appearance inspection such as solder ball inspection takes place on the side-inversing table.
Non-conforming packages can be set in the tray for Non-conforming packages optionally.

Employs 8-division rotary pickup table

Digitalizes positioning unit

Makes adjustment unnecessary due to model changes by replacing jigs

Realizes operation rate ob 95% or above

Package mapping function (option)

Pick up speed	0.45 sec/pacage
Applicable work	Compact leadless package 0.6 to 6mm
Applicable ring size	Max φ8inch DTF2-8-1
Carrier tape	Emboss tape with width of 8, 12, or 16mm
Supply reel	Maximum outside diameter φ700mm
Store reel	Maximum outside diameter φ300mm
Machine dimensions	1,540(W)×1,300(D)×1,950(H)mm