CAP series is a full automatic die sorter. It picks up only accepted dice from asawed wafer.
Then, the dice are arrenged and stored in a cavity of tray. High speed and stable continous work is realized and reliability is progressed by employing a sort and low vibratory digital head.

High-peed digital heads provide fast, low-vibration direct pickup.
Pickup and plunge-up are synchronized to reduce the load on the chip.

Up to 90 2-inch trays can be supplied and stored. A new transport system halves the tray change time.

English-language display for the operating system improves operability.
Model changes and setup can be carried out quickly.

Compact size, capable of handling 8-inch wafers.

Capable of handling 4-inch trays, with ideal, aligned storage of large chips.

chip recognition is done through multivaluing the outline dimension or pattern-matching system.

JEDEC tray-capable CAP 310 equipment also available.

Pick up speed	0.5 sec/die
Applicable tray size	2", 3", 4"
Applicable wafer size	8" MAX
Applicable wafer ring size	8" : DTF2-8-1 6" : DTF2-6-1
Applicable die size	□3〜□20mm
Machine dimensions	1,220(W)×1,180(D)×1,630(H)mm