CANON MACHINERY INC
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HOME > Products > Die Sorter > [High Performance Chip Sort System] BESTEM-S300

BESTEM-S300

Features
BEST TCO
High UPH, Small Foot Print, Minimized Conversion
Best Quality
High Accuracy XY: 38ƒÊm(3ƒÐ)
Countermeasure for Fragile devices
Ex, IR cut Filter, other transparent glass
Defective Chip Inspection
Capable of backside inspection
Flexible Die P/U Capability
 1.0`12.5mm with high quality
Specifications
Target Device Si,Glass
Cycle time 0.38sec/cycle
Arrangement accuracy XY: 38ƒÊm,3ƒÐ
Die size  1.0` 12.5mm t=0.1`1.0mm
Tray size 2/3/4 inch
Tray thickness 2`8mm
Ring size Max 8-inch
Tray size conversion time 12 minites
Tray stock size MAX:250mm
Loader Tray stacking system
Unloader Pallet system
Recognition system Pocket recognition(CMOS camera)
Inspection system Visual inspection system(Option)
Power requirement Power supply:AC200V 20A
Dry air:0.4MPa(60L/min)
Vacuum:-66.7KPa(100L/min)
Weight 1,200 kg