| ”Mounter | ||
| Modei Name | Equipment Name | Outline |
|---|---|---|
| Clip Bonder | Clip Bonder | This equipment feeds lead frames that are chip-bonded in prior process by magazine stacker loader. As it pitch-feeds on the transport rail, it applies paste material on chips and joint position for clips, and finally it loads the clips that are pierced though hoop frame to the chip-bonded lead frames. |
| Frame Mounter | Frame Mounter | Please ask for details. |
| ”Curing Oven | ||
| Modei Name | Equipment Name | Outline |
|---|---|---|
| BCOS-IV | In Line Curing Oven | BCOS-4 is designed compactry to combine with CPS-100 series. Therr are various combinations. |
| ”Laser Gragh | ||
| Modei Name | Equipment Name | Outline |
|---|---|---|
| FLAG-300 | Flexible Laser Graph | The equipment removes the molded IC lead frame from the magazine cassette and supplies it to the transport rail. After determining the front/back as wall as if it is in a reversed direction, it is marked with a laser marker at the prescribed place. |