The equipment removes the molded IC lead frame from the magazine cassette and supplies it to the transport rail.
After determining the front/back as wall as if it is in a reversed direction, it is marked with a laser marker at the prescribed place. Before and after marking, the molded surfaces are brushed and the lead frames are deposited into magazine cassettes one after the other. The empty magazine automatic feedind function makes unnecessity of preparation for empty magazines to receive the molded frames.

Many types of frame shapes are supported (lead frames, CSP, Tape BGA)

Enhanced flexibility allows for an even greater reduction in the time required for changing types

Supports flow stamping while feeding at slow speeds, and stationary stamp marking in pitch feeding

Almost no dust from resin burrs

Achieves easy operation through the use of a user-friendly graghic panel

Saves space

Applicable device	Mold IC lead frame
Capacity	2.7sec/frame (MAX)
Transfer speed	Stationary stamping：0.2〜0.25mm/pitch Flow stamping：150mm/sec
Marking area	50×50mm (standard)
System for determining marking position	±0.05mm
Frame size	Width：20〜70mm　Length：140〜250mm
Magazine size	Width：22〜72mm　Length：142〜255mm　Height：200〜400mm
No. of types that can be recorded	32
Frame conversion time	Within 1 min. (Fully-Automatic)
Machine dimensions	1,500(W)×1,200(D)×1,700(H)mm