This equipment feeds lead frames that are chip-bonded in prior process by magazine stacker loader. As it pitch-feeds on the transport rail, it applies paste material on chips and joint position for clips, and finally it loads the clips that are pierced though hoop frame to the chip-bonded lead frames.

Mount head makes uses of digital method, high-speed and low vibration.

Achieves easy adjustment and types-conversion thouth teaching function.

Carries two sets of dispensing unit.

Bonding system	Epoxy, Solder
Bonding speed	1.0 sec/cycle
Bonding accuracy	±50μm（X,Y Peak to Peak）　±3°（Θ Peak to Peak）
Lead frame size	Length : 120〜260mm Width : 15〜80mm Pitch : 3〜55mm Thickness : 0.1〜0.6mm
Clip hoop frame size	Width : 9〜40mm Pitch : 2.5〜10mm Thickness : 0.1〜0.3mm
Chip size	□1.0mm〜
Applicable lead frame magazine	Length : 260mm Max Width : 90mm Max Pitch : 2mm Min Height : 0.1〜0.6mm
Machine dimensions	1,300(W)×1,050(D)×1,742(H)mm