BCOS-4 is designed compactry to combine with CPS-100 series. Therr are various combinations. For example, a die bonder with a curing oven, an in-line system with a wire bonder.

Equal heating is realized by employing a radiant and direct heating system from the heater block and a hot N2 down flow heating system from the chamber to set suitable temperature profile freely.

For clean curing, BCOS-4 provides a gas exhausting system which impurity gas is caused from Ag paste.
It also provides O2 shut out system so that Cu frames are applicable.

Manual operation system for lead frame change.

Temperature range	RT 〜 400°C
Cycle time	6.0 〜 999.9 sec
Curing time	6 sec × 8 step　MIN.
Leed frame size	120 (L) × 16 (W) mm MIN.　260 (L) × 51 (W) mm MAX.
Lead frame set-up	Manual
Temmperature state	8 kinds of profile can be set
Machine dimensions	720 (W) × 1,000 (D) × 1,544 (H) mm