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HOME > Products > Inspection equipment > Automated Wire Bonding Inspection System

Automated Wire Bonding Inspection System

This system has automatic inspection function and carries out the appearance check necessary for wire-bonding process efficiently. Therefore, this system has 3D inspection function, and makes out high-integrity inspection results.
Available to inspect reproducibility for portion of aluminum wire -wedge by high-precision 3D image enhancement technology.
Additionally, enable to measure extremely small pitch of extra-fine line by newly-developed optical system and software processing.



Features
High-accuracy measurement of steep incline by 3D inspection of Shape-from-focus.
The highest level of measurement accuracy.
Easy setup function.
Adapt to loader and unloader mechanism.

Specifications

Depth estimation by the just focus position that maximize focus measure at each point of view.
The non-blur image by collecting the best-focused pixel data at each point of view.

focus-algorithm


Compact packaging solutions for power devices

Enable to 100% inspection of compact packaging for power device.
Method of inspection that is ideal for high reliability device, as exemplified by automobile device.

Inspection objects Wedge bonding
Wire diameter 50`300m
Inspection items

Wire loop inspection

Wire loop inspection

Wedge bond inspection

edge Bond inspectionchip-position

Optional inspection

Optional inspectioncontamation
Field of view 4.8mm
Measurement time 1.0 secias of depth 0.8mmj
Repeat accuracy(3) Bond widthF5.0m      Wire heightF5.0m

IC packaging solutions

This system has Low and high magnification optics system.
Available for ball bond inspection, in addition to wedge bond inspection.

Inspection objects Wedge bonding, ball bonding
Wire diameter 17`300m
Inspection items

Wire loop inspection

Wire Bond inspection

Wedge bond inspection

Wedge bond inspection

Ball bond inspection

Ball bond inspection

Optional inspection

Optional inspection
Field of view Low mag. optics typeF4.8mm
High mag. optics typeF0.7mm
Measurement time 1.0 seciLow mag. optics typeFas ofdepth0.8mmj
Repeat accuracy(3) Bond widthF5.0m      Wire heightF5.0m      Ball heightF1.0m
Specifications are subject to change without prior notice for improvement.

 

 

yINQUIRYz
 CANON MACHINERY INC. SEMICON SYSTEM BUSINESS HQ. SALES DIV.
 Tel : +81 77 566 1822
 E-Mail :sales-ml@canon-machinery.co.jp