This is a multiple back-end machine that has the process of pick up, electrical testing, vision inspection, marking (option) and taping in a lump, regarding the compact leadless package (CSP) that is installed on wafer sheet.

Leadless package is picked up from wafer sheet.

Achievement of UPH 12000 (0.3 sec/conponent high-speed processing)

Flexible conversion φ8 inch wafer ring capability

Flexible setting by Grafical User Interface (GUI)

Cycle time	0.3 sec/PKG
Test time	0.25 sec/PKG
Applicable device	CSP, BGA
Applicable package size	□0.6×1.0mm〜□6mm
Applicable ring size	φ8 inch flat ring (possible for φ6 inch)
Applicable ring magazine	φ8 inch standard (possible for φ6 inch)
Pck up hesd	Digital
Taping soecification	8 mm width emboss tape (2 lanes) (option 3 lanes)
Machine dimensions	2,450(W)×1,250(D)×2,000(H)mm