| Model Name | Equipment Name | Outline |
|---|---|---|
| MACS-‡U | Multi Back-end System | This equipment is a remarkable complex finishing system for mini-mold devices (SMD type) as small signal transistors or diodes. |
| MACS-300 | Leadless Multi Back-end System | This is a multiple back-end machine that has the process of pick up, electrical testing, vision inspection, marking (option) and taping in a lump, regarding the compact leadless package (CSP) that is installed on wafer sheet. |