CANON MACHINERY INC
    Products
  1. Die Bonder
  2. Die Sorter
  3. Handler
  4. Inspection equipment
  5. Other semiconductor fabrication equipment
  6. Substrate processing equipment
  7. Electronic components related equipment
  8. Display & Liquid crystal related equipment
  9. IC card & IC tag related equipment
  10. Battery related equipment
  11. IR Image Furnace
  12. Automobile Electronic components related equipment
  13. Medical part assembly equipment
  14. Exhibition
  15. Discontinued Parts
HOME > Products > Exhibition > SEMICON Taiwan 2017
exhibition
SEMICON Taiwan 2017
It is our great pleasure to inform you that we will be introducing our products during the upcoming SEMICON Taiwan 2017 (September 13- 15, 2017) in Nangang District, Taipei City, Taiwan.
At this Exhibition, visitors will be able to see an exhibition of our new product lineup and demonstration of their products. Those who are coming to the exhibition are encouraged to please visit our booth. We are looking forward to seeing you at this exhibition.
Please see the below brief description of the product line that will be introduced during this exhibition.
Dates September 13 - 15 10:00 -17:00@/@September 15 10:00 - 16:00
Venue Taipei Nangang Exhibition Center, Taiwan
Booth No TWTC Nangang Hall (4 F) 316
Access http://www.twtcnangang.com.tw/zh-tw/transportation
Exhibit
Products
12inch SiP Die Bonder
BESTEM-D531t

 
For any enquiries, Please contact :
Canon Machinery Inc.SEMICON SYSTEM BUSINESS HQ@SALES DIVISION
85 Minami Yamada-cho, Kusatsu-shi, Shiga, Japan
Tel : +81 77 566 1822 ; Fax : +81 77 566 1833
E-Mail : sales-lmcanon]machinery.co.jp