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HOME > Products > Die Bonder > Needleless Pickup Unit

Needleless Pickup Unit

This unit enables high speed, non-damaging pickup of ultra-thin dies. Actually, the unit is able to pick up dies with a thickness of 40µm or less, which is generally acknowledged to be impossible with the conventional ejector pin method. (Patent) The unit can be mounted on die bonder and die sorter machines from Canon Machinery Inc., and can be supplied independently.
Features
High -speed pickup of dies with 20µm
Non-damaging pickup of brittle materials such as GaAs Scratches on the reverse side, cracks, and chipping are totally eliminated with the use of a 65µm-thick GaAs die pickup.
Ultra-high speed pickup of large-area dies Regardless of the die thickness, the tact time has been abridged by 50ms/die or more when compared to the conventional ejector pin method.
Applicable to Canon Machinery's equipment ready for 8-inch and 300mm. Fully compatible to conventional units with the ejector pin system. You can expect immediate operation by simply changing the connector. (The unit can be supplied independently.)
Specifications
Unit Dimensions 150(W)~325(D)~190(H)mm
Applicable Die Size 2.0×2.0 - 15.0×15.0 mm²
Applicable Machines 300-ready Epoxy Die Bonder BESTEM-D02
Die Sorter CAP-3000II
Soft Solder Die Bonder CPS-4000L
Flip chip Die Bonder CPM-7000
Other machines featuring an 8-inch type Expander of Canon Machinery Inc.