CANON MACHINERY INC
    Products
  1. Die Bonder
  2. Die Sorter
  3. Handler
  4. Inspection equipment
  5. Other semiconductor fabrication equipment
  6. Substrate processing equipment
  7. Electronic components related equipment
  8. Display & Liquid crystal related equipment
  9. IC card & IC tag related equipment
  10. Battery related equipment
  11. IR Image Furnace
  12. Automobile Electronic components related equipment
  13. Medical part assembly equipment
  14. Exhibition
HOME > Products > Die Bonder
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Model Name Equipment Name Outline Main uses
LSI/
MEMORY		 IC DISCRETE LED
BESTEM-D01/R Flexible Epoxy Die Bonder 　 　 ● ● ●
BESTEM-D02 Dia. 300 Die Bonder 　 ● ● 　 　
BESTEM-D11 8-inch High Performance Die Bonder ● ● ●
BESTEM-D15 Dia.300 High Performance Die Bonder ● ●
BESTEM-D03 Multi-Purpose Die Bonder 　 　 　 ●
CPS-4000L High-speed Soft Solder Die Bonder The fully automatic die bonder takes the strip type of rectangular lead frame supplied from the loader, pitch feeds it along the heat rail protected by the reduced environment. 　 　 ●
CPM-7000
series
 Flip Chip Die Bonder This equipment bonds (face down) chip picked up from a wafer to a lead frame and aceramic doard etc, that are fed by a loader. And it stores them to an unloader. 　 ● 　
Needleless Pickup Unit Needleless Pickup Unit The unit can be mounted on die bonder and die sorter machines from Canon Machinery Inc., and can be supplied independenthly. ● ● ●