The fully automatic die bonder takes the strip type of rectangular lead frame supplied from the loader, pitch feeds it along the heat rail protected by the reduced environment. After solder supply and scrub, bonding position is sensed and corrected by rec. system. Finally die bonding takes place and the frame is deposited in the unloader.

UPH 6,000 and up

High quality process control (High precision control of the thickness of solder, inclination of a pellet.)

Feeding pitch at the time of changing for different types are set digitally

Up to 4 types of temperature profiles settings may be set and stored to call up later.

Easy changing of lead frames

Saves space/Small foot print

Bonding method	Solder bonding
Cycle time	0.65 sec/cycle (without scrub2.0 under)
Bonding accuracy	± 100µm(X,Y)　± 3゜(Θ)
Wafer size	6"expand(OptionMax8")
Die size	□1mm〜□8mm
Lead frame size	Length：120〜250mm　Width：10〜40mm
	Pitch：Max 25mm　Tickness：0.3〜1.5mm(Island)
Machine dimensions	1,570(W)×1,220(D)×1,845(H)mm