CANON MACHINERY INC
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HOME > Products > Die Bonder > Flip Chip Die BonderCPM-7000

Flip Chip Die BonderCPM-7000

This equipment bonds (face down) chip picked up from a wafer to a lead frame and aceramic doard etc, that are fed by a loader. And it stores them to an unloader.

Features
Consisting of a pickup head that vacumes and rotates chips and a bonding head of ultra sonic and thermo-compression-bonding type or thermo-compression-bonding type.
Coil spring adjusting method (1.47N - 19.6N) for pickup loading. Auto teaching pickup Z-axis height by a touch sensor.
A bonding head has a chip correction function with a voice coil disconnection detection.
Type Ultra sonic and thermo-compression thermo-compression Work
CPM-7100 Y 　 Ceramic etc.
CPM-7200 Y 　 Ceramic etc.
CPM-7300 Y 　 Lead frame
CPM-7400 　 Y Lead frame
CPM-7500 　 Y Ceramic etc.
Specifications
Bonding System Ultra Sonic (US power 0.2W - 10W)
Bonding Speed 1.4 sec/cycle (include 0.5 sec process time)
Bonding accuracy XY:±5µm
Wafer size 8" Max
Die size 0.3mm - 1.5mm
Machine dimensions 1,235(W)×1,230(D)×1,700(H)mm