CANON MACHINERY INC
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HOME > Products > Die Bonder >[12-inch High Performance Die Bonder] BESTEM-D531t

Flexible Epoxy Die BonderBESTEM-D01/R

Features
Thin Die Capability
2 motion needleless pick up system, up to 15m
Highest Accuracy Bonding Capability
Achieves die-bonding accuracy of }8m, =}0.05 (3)
Flexible Handling
Able to handle the lead frame size of 1.0`25.0mm, and the substrate size of Length 100`300mm
Specifications
Bonding method Heat processiWL-DAFj/DAF tape supply
Bonding speed 1.8sec/cycle
Bonding accuracy XYF}8mA3
ƁF}0.05A3
Die size 1.0`25.0mm@15m`
Lead frame size LengthF100`300mm
WidthF30`102mm
Magazine size LengthF100`315mm
WidthF30`115mm
ThicknessF50`200mm
PitchF3mm`
Wafer size Max 12 inch
Power requirements Power supplyFAC200V@30A
Dry airF0.5MPai60L/minj
VacuumF-80KPai100L/minj
Machine dimensions 2,160(W) ~ 1,470 (D) ~1,600 (H) mm
iwithout signal tower, cover closedj
Weight 1,850 kg