CANON MACHINERY INC
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HOME > Products > Die Bonder >[12-inch High Performance Die Bonder] BESTEM-D510

Flexible Epoxy Die BonderBESTEM-D01/R

Features
BEST TCO
High UPH, Small Foot Print, Minimized Conversion
More User Friendly
Easy Adjustment & Conversion, Rework Function
Best Quality
Paste dry up countermeasure
New Twin Dispense System
UPH improvement for any type of paste, flexible process control
Thin Die Capability
2 motion needleless pickup system, up to 15m
Specifications
Bonding method Epoxy/Heat processiOptionj
Bonding speed 0.18sec/cycle
Bonding accuracy XYF}25mA3
ƁF}1A3ЁiAbove 1.0mmj
ƁF}3A3ЁiBelow1.0mmj
Die size 0.3`8.0mm@0.075`0.5mm
OptionF0.15`2.0mmiLens conversionsj
Lead frame size LengthF50`300mm
WidthF20`102mm
ThicknessF0.075`2.0mm
DimpleF0`1.0mm
Magazine size LengthF100`315mm
WidthF35`115mm
ThicknessF50`200mm
PitchF3mm`
Wafer size Max 12 inch
Power requirements Power supplyFAC200V@30A
Dry airF0.4MPai60L/minj
VacuumF-66.7KPai100L/minj
Machine dimensions 1,930(W) ~ 1,400 (D) ~1,600 (H) mm
iWithout signal tower, cover closedj
Weight 1,600kg

IvV
Option Magazine stacker loader
Mt 1ch process heateriMAX200-1CHj
Ionizer blower
Needleless pick up unit
Wafer Mapping