CANON MACHINERY INC
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HOME > Products > Die Bonder > [8-inch High Performance Epoxy Die Bonder]BESTEM-D310

Flexible Epoxy Die BonderBESTEM-D01/R

Features
BEST TCO
High UPH, Small Foot Print, Minimized Conversion
Best Quality
Paste DRY UP, Countermeasure
Large Panel Handling Capability
Lead flame maximum sizeF[v]102mm [k]300mm
New Twin Dispensing System
UPH Improvement for any type of paste.
Flexible process control
Small Die Pickup Capability
Specifications
Bonding method Epoxy resign
Bonding speed 0.165sec/cycle
Bonding accuracy

XYF}25mA3
ƁF}1A3ЁiAbove1.0mmj
ƁF}3A3ЁiBelow1.0mmj

Die size 0.3`8.0mm@0.1`0.5mm
OptionF0.15`2.0mm
Lead frame size LengthF50`260mmiUp to 300mm as optionj
WidthF20`100mm
ThicknessF0.1`3mm
Magazine size LengthF50`260mmiUp to 300mm as optionj
WidthF20`110mm
ThicknessF50`200mm
PitchF3mm`
Wafer size Max 8 inch
Power requirements Power supplyFAC200V@20A
Dry airF0.4MPai60L/minj
VacuumF-66.7KPai100L/minj
Machine dimensions 1,600(W) ~ 1,130 (D) ~1,630 (H) mm
iWithout signal tower, cover closedj
Weight 1,200kg

IvV
Option Magazine stacker loader
Ionizer blower
Needleless Pick Up
Wafer Mapping