- High Bonding Speed
- Switching of bonding systems 60 min.
- A powerful set-up wizard
- Solder / Gold Eutectic, Epoxy Function
-
| Bonding system |
Solder / Gold Eutectic, Epoxy resin |
| Bonding Speed |
[Solder] 0.4 sec/cycle (Die size 1mm)
[Gold Eutectic, Epoxy] 0.2 sec/cycle (Die size 0.3mm) |
| Bonding accuracy |
[Solder] ±50µm(X,Y) ± 3゜(Θ)
[Gold Eutectic, Epoxy] ±38µm(X,Y) ± 3゜(Θ) |
| Die size |
[Solder] □0.6～□2 mm
[Gold Eutectic] □0.25～□1 mm
[Epoxy] □0.15～□2 mm (Up to □6 mm, as option) |
| Lead frame size |
Length: 120～260 mm Width: 12～80 mm Tickness: 0.1～1.0
mm
Amount of dimples: 0～2 mm |
| Magazine size |
Length: 120～260 mm Width: 20～110 mm Height: 50～200 mm
Pitch: 3 mm～ |
| Wafer size |
Max 8" |
| Machine dimensions |
1,850(W)×1,190(D)×1,585(H)mm |
| Weight |
1,200 kg |
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| Loader |
Supports Double loader / Separator / Hard case |
| Other |
Supports mapping |
