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HOME > Products > Die Bonder > Dia. 300 Die BonderBESTEM-D02

Dia. 300 Die BonderBESTEM-D02

Features
Bonding Speed 0.29 sec/cycle
Change time for registered kinds is only 10 minutes or 30 minutes even for a new article kind.
A powerful set-up wizard
Epoxy / thermal bonding applicagle
Specifications
Bonding system Epoxy resin / Thermal bonding (option)
Bonding Speed 0.29 sec/cycle (chip size within 3mm)
Bonding accuracy ±25µm(X,Y)　± 0.5゜(Θ)
Die size □5～□20 mm Tickness: 0.1～0.5 mm, 0.025～0.1 mm (option: needleless)
Lead frame size Length: 90～260 mm　Width: 20～80 mm Tickness: 0.05～1.0 mm
Amount of dimples: 0～0.5 mm
PCB size Length: 40～150 mm　Width: 20～70 mm Tickness: 0.1～1.0 mm
Magazine size Length: 50～260 mm　Width: 20～110 mm Height: 50～200 mm
Pitch: 3 mm～
Wafer size Max 12"
Machine dimensions 1,440(W)×1,150(D)×1,620(H)mm