- Bonding Speed 0.19 sec/cycle
- Stable operation is realized for a long time.MTBA 4 hours
- Kind change time was shortened sharply. Kind change time: 10 minutes
- The registration time of a new article kind was shortened.
Registration time: 30 minutes
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Bonding system Epoxy Bonding Speed 0.19 sec/cycle Bonding accuracy XY:±38µmΘ:±3° Tip size □0.15～□2 mm (□2.0～□6.0 mm Option) Tickness: 0.1～0.5 mm Lead frame size Length: 120～260 mm Width: 20～70 mm Tickness: 0.1～1.0 mm
Amount of dimples: 0～0.8 mmPCB size Length: 50～150 mm Width: 20～70 mm Tickness: 0.1～1.0 mm Magazine size Length: 50～260 mm Width: 20～90 mm Height: 50～200 mm
Pitch: 3 mm～Wafer size Max 8" Machine dimensions 920(W)×900(D)×1,550(H)mm