佳能机械株式会社
    产品介绍
  1. Die Bonder
  2. Die Sorter
  3. Handler
  4. 检查装置
  5. 其他半导体装置
  6. 基板加工关联装置
  7. 电子部件关联装置
  8. 表示,液晶关联装置
  9. IC卡片,IC名牌关联装置
  10. 电池关联装置
  11. 汽车电装饰关联装置
  12. 医疗部件组成装置
  13. 展览会
HOME > 产品简介 > 芯片分类机 > [High Performance Chip Sort System] BESTEM-S300

BESTEM-S300

Features
BEST TCO
High UPH, Small Foot Print, Minimized Conversion
Best Quality
High Accuracy XY: 38μm(3σ)
Countermeasure for Fragile devices
Ex, IR cut Filter, other transparent glass
Defective Chip Inspection
Capable of backside inspection
Flexible Die P/U Capability
□1.0~12.5mm with high quality
Specifications
Target Device Si,Glass
Cycle time 0.38sec/cycle
Arrangement accuracy XY: 38μm,3σ
Die size □1.0~□12.5mm t=0.1~1.0mm
Tray size 2/3/4 inch
Tray thickness 2~8mm
Ring size Max 8-inch
Tray size conversion time 12 minites
Tray stock size MAX:250mm
Loader Tray stacking system
Unloader Pallet system
Recognition system Pocket recognition(CMOS camera)
Inspection system Visual inspection system(Option)
Power requirement Power supply:AC200V 20A
Dry air:0.4MPa(60L/min)
Vacuum:-66.7KPa(100L/min)
Weight 1,200 kg