佳能机械株式会社
    产品介绍
  1. Die Bonder
  2. Die Sorter
  3. Handler
  4. 检查装置
  5. 其他半导体装置
  6. 基板加工关联装置
  7. 电子部件关联装置
  8. 表示,液晶关联装置
  9. IC卡片,IC名牌关联装置
  10. 电池关联装置
  11. 汽车电装饰关联装置
  12. 医疗部件组成装置
  13. 展览会
HOME > 产品简介 > 其他半导体装置
其他半导体装置
Mounter
Modei Name Equipment Name Outline
Clip Bonder Clip Bonder This equipment feeds lead frames that are chip-bonded in prior process by magazine stacker loader. As it pitch-feeds on the transport rail, it applies paste material on chips and joint position for clips, and finally it loads the clips that are pierced though hoop frame to the chip-bonded lead frames.
Frame Mounter Frame Mounter Please ask for details.
Curing Oven
Modei Name Equipment Name Outline
BCOS-IV In Line Curing Oven BCOS-4 is designed compactry to combine with CPS-100 series. Therr are various combinations.
Laser Gragh
Modei Name Equipment Name Outline
FLAG-300 Flexible Laser Graph The equipment removes the molded IC lead frame from the magazine cassette and supplies it to the transport rail. After determining the front/back as wall as if it is in a reversed direction, it is marked with a laser marker at the prescribed place.
Gang Press M/C
Modei Name Equipment Name Outline
KLIPs-1364s Gang Press M/C for LEP Process This equipment is a gang pres machine which presses LED chips mounted to the substrate by LEP process while applying heat.