HOME > 产品简介
| 对象领域 | 装置分类 | 概略 |
|---|---|---|
半导体 |
Die Bonder | It is equipment which a dice is taken up and carried in a leadframe or a substrate from a wafer. Abundant variations are developed on the actual result of domestic market share No.1. |
| Die Sorter | It is equipment which only an excellent article dice is taken up, and is aligned and contained from a wafer at a tray. | |
| Handler | CSP (chip-size package) is taken up and there are measurement, a seal, appearance inspection, and a compound machine that carries out batch processing of the process to taping. In addition to this, we are manufacturing the handler corresponding to individual specification. |
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| 检查装置 | ||
| 其他半导体装置 | They are equipments, such as a cure furnace, a laser marker, and mounter. | |
电子部件 |
基板加工关联装置 | It is introduction of a substrate cutting machine. |
| 电子部件关联装置 | The equipment corresponding to each specifications like the assembly, welding, an application, washing, processing, molding, inspection, alignment, and mounting of various electron devices is manufactured. Please ask for details. |
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| 表示，液晶关联装置 | Equipments corresponding to individual specification, such as PDP, LCD, a touch panel, and glass, are manufactured. Please ask for details. |
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| IC卡片，IC名牌关联装置 | It is the field to be strengthened as a new enterprise from now on based on substrate molding trimming equipment, reinforcement board pasting equipment, etc. Please ask for details. |
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能关联 |
电池关联装置 | It is rechargeable battery (lithium ion, lithium polymer, solar cell) assembly line. Please ask for details. |
其他 |
汽车电装饰关联装置 | The assembly line for automobile electronic components is manufactured. Please ask for details. |
| 医疗部件组成装置 | Assembly lines, such as medical tools, are manufactured. Please ask for details. |