佳能机械株式会社
    产品介绍
  1. Die Bonder
  2. Die Sorter
  3. Handler
  4. 检查装置
  5. 其他半导体装置
  6. 基板加工关联装置
  7. 电子部件关联装置
  8. 表示,液晶关联装置
  9. IC卡片,IC名牌关联装置
  10. 电池关联装置
  11. 汽车电装饰关联装置
  12. 医疗部件组成装置
  13. 展览会
HOME > 产品简介 > 芯片分装机
Handler
Model Name Equipment Name Outline
MACS-II Multi Back-end System This equipment is a remarkable complex finishing system for mini-mold devices (SMD type) as small signal transistors or diodes.
MACS-300 Leadless Multi Back-end System This is a multiple back-end machine that has the process of pick up, electrical testing, vision inspection, marking (option) and taping in a lump, regarding the compact leadless package (CSP) that is installed on wafer sheet.